Semiconductor packaging is the last mile of chip production and also a hot innovation topic in the post Moore era. In recent years, with the development of automotive electronics, artificial intelligence and other fields, the requirements for semiconductor packaging have become increasingly high, especially in the automotive grade packaging and 2.5D, 3D packaging, which have become the fastest growing advanced packaging technologies.

Car grade packaging refers to semiconductor packaging that meets automotive industry standards and has characteristics such as high reliability, high temperature resistance, and anti-interference. With the trend of automotive intelligence, electrification, and networking, the demand for automotive grade chips is constantly increasing. It is expected that the global automotive grade chip market will reach 60 billion US dollars by 2025.

2.5D and 3D packaging refer to the use of technologies such as silicon via, silicon bridge, and chips to stack chips with different functions together, achieving heterogeneous integration and high-density interconnection. This packaging technology can improve chip performance, reduce power consumption, reduce size, and lower costs, and is suitable for fields such as artificial intelligence, high-performance computing, and 5G communication.

At present, the global leaders in semiconductor packaging are mainly international giants such as TSMC, Samsung, and there is still a certain gap in China in this regard. However, there are also many semiconductor packaging companies and research institutions in China actively catching up, such as Changdian Technology, Tongfu Microelectronics, Huatian Technology and other companies are expanding production capacity and investing in research and development. Academician Wu Hanming, Dean of the School of Microelectronics and Nanoelectronics at Zhejiang University, and other experts are also exploring innovative paths for heterogeneous integrated circuits.

It is reported that China also attaches great importance to the development of semiconductor packaging technology and has introduced a series of policies and measures to support the construction and upgrading of the semiconductor packaging industry chain. In the future, with the promotion of market demand and technological innovation, the semiconductor packaging industry in China will face more opportunities and challenges.